Semiconductor device having a ball grid array package structure

Details Semiconductor device having a ball grid array package structure Semiconductor device having a ball grid array package structure

1997-02-25

1999-06-22

Ostrowski, David

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257675, 257676, 257738, 257780, 361707, 361711, 361831, H01L 23495

Patent

active

059145315

ABSTRACT:
A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.

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patent: 5365106 (1994-11-01), Watanabe
patent: 5391916 (1995-02-01), Kohno et al.

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