Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate
2002-02-21
2003-08-19
Clark, Sheila V. (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
C257S783000, C257S784000, C257S787000
Reexamination Certificate
active
06608387
ABSTRACT:
CROSS-REFERENCE TO RELATED APPLICATIONS
This application is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 2001-048002, filed Feb. 23, 2001, the entire contents of which are incorporated by reference.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a semiconductor device formed by mounting a semiconductor chip on a support substrate, using the inner lead bonding (hereinafter referred to as an “ILB”), and to the support substrate.
2. Description of the Related Art
FIG. 6
is a plan view illustrating a conventional semiconductor device viewed from the bottom. For facilitating the explanation,
FIG. 6
does not show a resin.
FIG. 7
is a sectional view taken along line VIB-VIB′ in FIG.
6
.
As shown in
FIGS. 6 and 7
, a support substrate
31
includes a support member
42
formed of a square insulation tape. The support member
42
has a pair of slim device holes
41
extending along a pair of opposite sides of the member and pierced through the thickness of the member.
A plurality of finger leads
44
made of, for example, Cu foil plated with Au, are provided in a predetermined pattern on the upper surface of the support member
42
. The finger leads
44
are fixed to the support member
42
by an adhesive
43
. Each finger lead
44
has one end reaching a corresponding device hole
41
, and the other end extending to the device holes
41
. Each finger lead
44
, except for the one end, and the upper surface of the support member
42
are coated with a solder resist
45
.
Solder balls
35
, serving as external terminals, are arranged in a matrix on the lower surface of the member
42
between the pair of device holes
41
. The distance between each pair of adjacent solder balls is d
2
. Each solder ball
35
is electrically connected to the other end of a corresponding finger lead
44
via a corresponding through hole
46
formed in the support member
42
.
A semiconductor chip
32
such as an integrated circuit is provided and fixed on the upper surface of the support substrate
31
, with a cushion member
33
interposed therebetween. Each electrode pad
47
of the semiconductor chip
32
is electrically connected to a corresponding finger lead
44
. The connection between the finger leads
44
and the semiconductor chip
32
is executed using an ILB device. For example, after aligning the finger leads
44
with the electrode pads
47
of the semiconductor chip
32
, they are simultaneously coupled by thermocompression bonding, using a bonding tool.
A resin
34
is filled between the semiconductor chip
32
and the support substrate
31
through the device holes
41
from the lower surface of the substrate
31
, thereby sealing upper surface portions of the support substrate
31
, those portions of the finger leads
44
, which are located in the device holes
41
, side surface portions of the chip
32
, and those surface portions of the substrate
31
, which are opposed to the chip.
FIG. 8
is a plan view illustrating finger leads
44
formed on the support member
42
. This figure shows a state assumed before the finger leads
44
are electrically connected to the electrode pads
47
of the semiconductor chip
32
. Each finger lead
44
bridges the device hole
41
from one edge portion to the other edge portion of the hole. Each finger lead
44
has one end connected to one end of any other finger lead
44
, and the other end formed circular and provided over a corresponding through hole
46
of the support member
42
. Furthermore, each finger lead
44
has indented portions
441
located near the one edge portion of the device hole
41
. When coupling the finger leads
44
to the semiconductor chip
32
by thermocompression bonding, each finger lead
44
is cut at the indented portions
441
and coupled to a corresponding electrode pad
47
by thermocompression.
However, when connecting a finger lead
44
a
to a solder ball
35
remote from the device hole
41
, it is necessary to pass the finger lead between through holes
46
a
and
46
b
filled with solder balls
35
close to the device hole
41
. If the through holes
46
a
and
46
b
are arranged with a narrow pitch, it is difficult to pass the finger lead
44
a
between the through holes.
In addition, to provide one or more finger leads
44
between through holes
46
, it is necessary to secure a sufficient distance between the through holes
46
in light of the width of the finger lead(s). Accordingly, the distance d
2
must be set large, which inevitably enlarges the entire semiconductor device.
The same problem will occur in the case where a device hole
41
is formed along each side of the support substrate
31
, or where finger leads
44
are extended from external terminals arranged in three or more rows with respect to one device hole
41
, like the uppermost and lowest row as shown in the FIG.
6
.
BRIEF SUMMARY OF THE INVENTION
According to a first aspect of the invention, there is provided a semiconductor device comprising: a support member having first and second major surfaces and an elongate hole extending between the first and second major surfaces, the hole having first and second elongate edges opposite to each other; a plurality of first external connection terminals provided along the first edge of the hole, the first external connection terminals each having one end located above the second major surface of the support member; a plurality of second external connection terminals provided along the second edge of the hole, the second external connection terminals each having one end located above the second major surface of the support member; a semiconductor chip provided on the first major surface of the support member, the semiconductor chip including connection pads provided in a region corresponding to the hole; first and second connection wires which electrically connect the connection pads to other ends of the first and second external connection terminals, respectively; and an insulation material filled in the hole.
According to a second aspect of the invention, there is provided a support substrate used to form a semiconductor device, together with a semiconductor chip provided on the support substrate, comprising: a support member having first and second major surfaces and an elongate hole extending between the first and second major surfaces, the hole having first and second elongate edges opposite to each other; a plurality of first external connection terminals provided along the first edge of the hole, the first external connection terminals each having one end located above the second major surface of the support member; a plurality of second external connection terminals provided along the second edge of the hole, the second external connection terminals each having one end located above the second major surface of the support member; and first and second connection wires formed of a conductive material, the first and second connection wires having respective first ends connected to the first and second external connection terminals, and second ends located above the hole.
REFERENCES:
patent: 5311056 (1994-05-01), Wakabayashi et al.
patent: 6054773 (2000-04-01), Ohsawa et al.
patent: 6107676 (2000-08-01), Suzuki
patent: 6169329 (2001-01-01), Farnworth et al.
patent: 6433440 (2002-08-01), Ogino et al.
Clark Sheila V.
Finnegan Henderson Farabow Garrett & Dunner L.L.P.
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