Semiconductor device fabricating method

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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254672, 254238, H01L 218242

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active

061626775

ABSTRACT:
In a semiconductor device fabricating method for fabricating a semiconductor device having a high-density region in which transistors are arranged with a relatively high density, and a low-density region in which transistors are arranged in with a relatively low density, a silicon nitride film of a thickness great enough for the silicon nitride film to serve as a stopper is deposited over the entire surface of the silicon wafer, so that regions between the transfer gates in the high-density region may not be blocked up after removing side walls formed in the entire transistor region. A part of the silicon nitride film in the low-density region, namely, a peripheral circuit region, is removed.

REFERENCES:
patent: 5554557 (1996-09-01), Koh
patent: 5702968 (1997-12-01), Chen
patent: 5710078 (1998-01-01), Tseng
patent: 5716881 (1998-02-01), Liang et al.
patent: 5792692 (1999-06-01), Li et al.
patent: 5796135 (1999-06-01), Liang et al.
patent: 5879986 (1999-03-01), Sung
patent: 5914510 (1999-06-01), Hieda
patent: 6013550 (2000-01-01), Lee et al.
patent: 6015733 (2000-01-01), Lee et al.
patent: 6077738 (2000-06-01), Lee et al.
patent: 6087225 (2000-07-01), Bronner et al.

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