Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Patent
1998-09-10
2000-12-19
Bowers, Charles
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
254672, 254238, H01L 218242
Patent
active
061626775
ABSTRACT:
In a semiconductor device fabricating method for fabricating a semiconductor device having a high-density region in which transistors are arranged with a relatively high density, and a low-density region in which transistors are arranged in with a relatively low density, a silicon nitride film of a thickness great enough for the silicon nitride film to serve as a stopper is deposited over the entire surface of the silicon wafer, so that regions between the transfer gates in the high-density region may not be blocked up after removing side walls formed in the entire transistor region. A part of the silicon nitride film in the low-density region, namely, a peripheral circuit region, is removed.
REFERENCES:
patent: 5554557 (1996-09-01), Koh
patent: 5702968 (1997-12-01), Chen
patent: 5710078 (1998-01-01), Tseng
patent: 5716881 (1998-02-01), Liang et al.
patent: 5792692 (1999-06-01), Li et al.
patent: 5796135 (1999-06-01), Liang et al.
patent: 5879986 (1999-03-01), Sung
patent: 5914510 (1999-06-01), Hieda
patent: 6013550 (2000-01-01), Lee et al.
patent: 6015733 (2000-01-01), Lee et al.
patent: 6077738 (2000-06-01), Lee et al.
patent: 6087225 (2000-07-01), Bronner et al.
Miyakawa Yasuhiro
Takase Shunji
Yajima Tsukasa
Bowers Charles
OKI Electric Industry Co., Ltd.
Schillinger Laura
LandOfFree
Semiconductor device fabricating method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device fabricating method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device fabricating method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-270611