Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2005-01-04
2005-01-04
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S691000, C257S724000, C257S693000
Reexamination Certificate
active
06838775
ABSTRACT:
The semiconductor device includes an input/output circuit, a functional module, an electrostatic discharge protection circuit and bumps. The input/output circuit is formed close to an edge of the semiconductor chip. The functional module is formed on the semiconductor chip located on a central side with regard to the input/output circuit. The electrostatic discharge protection circuit is formed in the functional module of the semiconductor chip and serves to protect a circuit located in a downstream thereof, from being destructed by electrostatic discharge. The bumps are arranged on one of major surfaces of the semiconductor chip located close to the functional module, and they are connected to the functional module via the electrostatic discharge protection circuit.
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Clark Jasmine
Gray Cary Ware & Freidenrich LLP
Kabushiki Kaisha Toshiba
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