Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate
2006-08-15
2006-08-15
Coleman, W. David (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
C257S686000, C257S700000
Reexamination Certificate
active
07091622
ABSTRACT:
A semiconductor device is provided with a metal stiffening layer between the die and a multilayer structure comprising at least two insulating layers each having at least one conductor thereon. A top insulating layer of the multilayer structure contains a ball grid array. The metal layer is used as an electrical ground plane to simplify the routing pattern of conductive traces on the insulating material. The metal layer may also be used to dissipate heat from the die. The conductors of the multilayer structure provide additional versatility in wiring the die to the ball grid array.
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Akram Salman
Kinsman Larry D.
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