Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2005-05-27
2009-08-11
Chu, Chris C (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257SE25006, C257S685000, C257S686000, C257S723000, C438S106000, C438S108000, C361S760000
Reexamination Certificate
active
07573136
ABSTRACT:
A multidie semiconductor device assembly or package includes an interposer comprising a substrate with at least one receptacle therethrough. A plurality of semiconductor device components (e.g., semiconductor devices) may be assembled with the interposer. For example, at least one contact pad of a semiconductor device component adjacent to one surface of the interposer may be electrically connected to a corresponding contact pad of another semiconductor device component positioned adjacent to an opposite surface of the interposer. As another example, multiple semiconductor device components may be at least partially superimposed relative to one another and at least partially disposed within a receptacle of the interposer.
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Australian Search Report, dated Feb. 28, 2005 (3 pages).
Chye Lim Thiam
Fee Setho Sing
Jiang Tongbi
Yean Tay Wuu
Chu Chris C
Micro)n Technology, Inc.
TraskBritt
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