Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent
1996-07-05
1999-06-22
Brown, Peter Toby
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
257779, 257780, 257786, H01L 2348
Patent
active
059145366
ABSTRACT:
A semiconductor device includes a wiring board having a main surface and a plurality of pad electrodes formed on the main surface, a rectangular semiconductor element having a main surface facing the main surface of the wiring board and mounted on the main surface of the wiring board, a solder resist formed to surround the semiconductor element with a preset distance therefrom on the main surface of the wiring board, a plurality of terminal electrodes formed on the end portion of the main surface of the semiconductor element, and a plurality of solder bumps for electrically connecting the plurality of pad electrodes to the plurality of terminal electrodes with a gap provided between the main surface of the wiring board and the main surface of the semiconductor element, wherein each of the plurality of pad electrodes includes at least a portion which extends from substantially under a corresponding one of the plurality of terminal electrodes of the semiconductor element to the solder resist lying outside the semiconductor element and each of the plurality of solder bumps includes a portion extending over part of a corresponding one of the plurality of pads which lies outside the semiconductor element.
REFERENCES:
patent: 3303393 (1967-02-01), Hymes et al.
patent: 3871014 (1975-03-01), King et al.
L.F. Miller "Microelectronic Device Standoffs " IBM Technical Disclosure Bulletin vol. 8. No. 3 Aug. 1965.
Iseki Yuji
Ono Naoko
Saito Masayuki
Shizuki Yasushi
Tateyama Kazuki
Brown Peter Toby
Kabushiki Kaisha Toshiba
Potter Roy
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