Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent
1997-07-07
2000-07-04
Whitehead, Jr., Carl
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
257666, 257779, 257787, H01L 2348
Patent
active
060843098
ABSTRACT:
A semiconductor device includes a semiconductor chip, a package encapsulating the semiconductor chip, a plurality of leads each having one end electrically connected to the semiconductor chip and another end exposed at a wall surface of the package to form an external terminal, where each of the leads excluding the external terminal is encapsulated within the package, and a lead projection provided on the external terminal of the lead. This lead projection projects from the wall surface of the package, so that a thickness of a soft bonding material provided on the external terminal can be increased to provide an improved bonding and connection when mounting the semiconductor device on a circuit substrate.
REFERENCES:
patent: 4280132 (1981-07-01), Hayakawa et al.
patent: 4697204 (1987-09-01), Mita et al.
patent: 5107325 (1992-04-01), Nakayoshi
patent: 5134773 (1992-08-01), LeMarie et al.
patent: 5172214 (1992-12-01), Casto
patent: 5304843 (1994-04-01), Takubo et al.
patent: 5363279 (1994-11-01), Cha
patent: 5444293 (1995-08-01), Li
Fujisawa Tetsuya
Kawashima Toyoshige
Sato Mitsutaka
Fujitsu Limited
Jr. Carl Whitehead
Potter Roy
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