Semiconductor device and process for producing the same

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – By reaction with substrate

Reexamination Certificate

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C438S777000, C438S792000

Reexamination Certificate

active

07033958

ABSTRACT:
A semiconductor apparatus is provided that is thermally stable in a post process and is suitable for fabricating a gate insulator having a laminated structure with various high permittivity oxides, and a process is provided for producing the same. In order to achieve a high function formation of a gate insulator, a silicon nitride film having a specific inductive capacity approximately twice as much as that of silicon oxide, and which is thermally stable, is not provided with a Si—H bond and is used as at least a portion of the gate insulator. Further, an effective thickness of a gate insulator forming a multilayered structure insulator laminated with a metal oxide having a high dielectric constant, in conversion to silicon oxide, can be thinned to less than 3 nm while restraining leakage current.

REFERENCES:
patent: 5043224 (1991-08-01), Jaccodine et al.
patent: 6136654 (2000-10-01), Kraft et al.
patent: 6309932 (2001-10-01), Ma et al.
patent: 6337289 (2002-01-01), Narwankar et al.
patent: 6348420 (2002-02-01), Raaijmakers et al.
patent: 6368923 (2002-04-01), Huang
patent: 6399445 (2002-06-01), Hattangady et al.
patent: 6610614 (2003-08-01), Niimi et al.
patent: 2002/0111000 (2002-08-01), Kawakami et al.
patent: 2002/0119673 (2002-08-01), Yieh et al.
patent: 55-145373 (1979-04-01), None
patent: 58-040833 (1981-09-01), None
patent: 58040833 (1983-03-01), None
patent: 10-135207 (1997-10-01), None
patent: 11-126902 (1998-08-01), None
patent: 2000-269483 (1999-03-01), None
patent: 2000269483 (2000-09-01), None
Phillip J. Caplan, Edward H. Poindexter, Bruce E. Deal and Reda R. Razouk, “ESR Centers, Interface States, and Oxide Fixed Charge in Thermally Oxidized Silicon Wafers”, J. Appl. Phys. 50(9), Sep. 1979, pp. 5847-5854.
F. B. McLean, “A Framework for Understanding Radiation-Induced Interface States in SiO2MOS Structures”, IEEE Transactions on Nuclear Science, vol. NS-27, No. 6, Dec. 1980, pp. 1651-1657.

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