Semiconductor device and process for producing the same

Details Semiconductor device and process for producing the same Semiconductor device and process for producing the same

1998-01-14

2000-05-09

Chaudhuri, Olik

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257666, H01L 23495

Patent

active

06060770&

ABSTRACT:
The thickness of a tape carrier package having a semiconductor chip is made uniform where bonding pads are concentrated on one side of the semiconductor chip. The tape carrier package is such that dummy pads 6b are arranged on one side opposite to the side on which bonding pads (effective pins) 6a are arranged in the semiconductor chip. Dummy leads 5 are formed on an insulating tape 4. The semiconductor chip is supported with inner lead portions 5a connected to the corresponding bonding pads 6a and the inner lead portions 5a of the dummy leads 5 connected to the corresponding dummy pads 6b.

REFERENCES:
patent: 5402255 (1995-03-01), Nakanishi et al.
patent: 5659198 (1997-08-01), Okutomo et al.
patent: 5726491 (1998-03-01), Tajima et al.
patent: 5767571 (1998-06-01), Kimura et al.
patent: 5825081 (1998-10-01), Hosomi et al.

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