4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. On insulating carrier other than a printed circuit board

Seiichi Ichihara

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Method of manufacturing a semiconductor device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Method of manufacturing a semiconductor device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Method of manufacturing a semiconductor device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Method of manufacturing a semiconductor device by...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate

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Semiconductor device and process for producing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1211906

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