Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2011-06-28
2011-06-28
Stark, Jarrett J (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S633000, C438S631000, C438S256000, C438S253000, C438S279000, C257SE21585, C257SE21648, C257S306000, C257SE27088
Reexamination Certificate
active
07968447
ABSTRACT:
A semiconductor device may include plugs disposed in a zigzag pattern, interconnections electrically connected to the plugs and a protection pattern which is interposed between the plugs and the interconnections to selectively expose the plugs. The interconnections may include a connection portion which is in contact with plugs selectively exposed by the protection pattern. A method of manufacturing a semiconductor device includes, after forming a molding pattern and a mask pattern, selectively etching a protection layer using the mask pattern to form a protection pattern exposing a plug.
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Kim Mo-Seok
Lee Dong-Sik
Lee Jong-Min
Lee Young-Ho
Park Jae-kwan
Baptiste Wilner Jean
Mills & Onello LLP
Samsung Electronics Co,. Ltd.
Stark Jarrett J
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