Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
Reexamination Certificate
2008-02-22
2011-11-01
Everhart, Caridad (Department: 2895)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Thinning of semiconductor substrate
C438S055000, C257SE21508, C257SE21483, C257SE21513
Reexamination Certificate
active
08048776
ABSTRACT:
A semiconductor device is made by providing a semiconductor wafer having an active surface, forming an under bump metallization layer on the active surface of the semiconductor wafer, forming a first photosensitive layer on the active surface of the semiconductor wafer, exposing a selected portion of the first photosensitive layer over the under bump metallization layer to light, removing a portion of a backside of the semiconductor wafer, opposite to the active surface, prior to developing the exposed portion of the first photosensitive layer, developing the exposed portion of the first photosensitive layer after removing the portion of the backside of the semiconductor wafer, and depositing solder material over the under bump metallization layer to form solder bumps. The remaining portion of the first photosensitive layer is then removed. A second photosensitive layer or metal stencil can be formed over the first photosensitive layer.
REFERENCES:
patent: 6263566 (2001-07-01), Hembree et al.
patent: 7141487 (2006-11-01), Periasamy et al.
patent: 2002/0084248 (2002-07-01), Kong et al.
patent: 2002/0137325 (2002-09-01), Shao
patent: 2003/0102158 (2003-06-01), Jimarez et al.
patent: 2004/0005770 (2004-01-01), Farnworth et al.
patent: 2005/0196939 (2005-09-01), Lee et al.
patent: 2005/0253261 (2005-11-01), Farnworth
patent: 2008/0113456 (2008-05-01), Codding et al.
Do Byung Tai
Huang Rui
Kuan Heap Hoe
Lin Yaojian
Atkins Robert D.
Everhart Caridad
Patent Law Group
STATS ChipPAC Ltd.
LandOfFree
Semiconductor device and method of supporting a wafer during... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device and method of supporting a wafer during..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method of supporting a wafer during... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4297668