Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2008-07-15
2010-11-30
Stark, Jarrett J (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S622000, C438S584000, C257S720000
Reexamination Certificate
active
07842607
ABSTRACT:
A semiconductor device has a conductive via formed around a perimeter of the semiconductor die. First and second conductive layers are formed on opposite sides of the semiconductor die and thermally connected to the conductive via. An insulating layer is formed over the semiconductor die. A portion of the insulating layer is removed to expose the first conductive layer and a thermal dissipation region of semiconductor die. A thermal via is formed through the insulating layer to the first conductive layer. A thermally conductive layer is formed over the thermal dissipation region and thermal via. A thermal conduction path is formed from the thermal dissipation region through the thermally conductive layer, thermal via, first conductive layer, conductive via, and second conductive layer. The thermal conduction path terminates in an external thermal ground point. The thermally conductive layer provides shielding for electromagnetic interference.
REFERENCES:
patent: 5600541 (1997-02-01), Bone et al.
patent: 6507115 (2003-01-01), Hofstee et al.
patent: 7271479 (2007-09-01), Zhao et al.
patent: 2008/0001283 (2008-01-01), Lee et al.
patent: 2008/0116588 (2008-05-01), Van Kleef et al.
Badakere Guruprasad G.
Camacho Zigmund R.
Tay Lionel Chien Hui
Atkins Robert D.
Stark Jarrett J
STATS ChipPAC Ltd.
Tobergte Nicholas
LandOfFree
Semiconductor device and method of providing a thermal... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device and method of providing a thermal..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method of providing a thermal... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4251645