Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having junction gate
Reexamination Certificate
2006-12-15
2008-09-23
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having junction gate
C438S202000, C257SE21632
Reexamination Certificate
active
07427542
ABSTRACT:
A method of manufacturing a semiconductor device including a complementary metal oxide semiconductor (CMOS) and a bipolar junction transistor (BJT), the method comprising the steps of: forming a gate oxide layer on a substrate having a p-type and an n-type well; removing the gate oxide layer on the p-type well; forming bases on the p-type well; forming a first photosensitive layer pattern that exposes the bases on the substrate; implanting p-type impurity ions into the bases through the first photosensitive layer pattern; removing the first photosensitive layer pattern; forming a second photosensitive layer pattern that exposes the p-type and the n-type wells; and implanting n-type impurity ions into the p-type and the n-type wells through the second photosensitive layer pattern to form an emitter and a collector, respectively, to form the BJT. Therefore, CMOS manufacturing processes are used to form a high frequency BJT having improved frequency and noise characteristics.
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Ahmadi Mohsen
Dongbu Electronics Co. Ltd.
Finnegan Henderson Farabow Garrett & Dunner L.L.P.
Geyer Scott B.
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