Semiconductor device and method of forming the device

Details Semiconductor device and method of forming the device Semiconductor device and method of forming the device

1997-03-18

1999-07-06

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

257666, 257676, 257687, 257706, H01L 23495

Patent

active

059201177

ABSTRACT:
A semiconductor device includes a board having a lower surface, a container part created in the board, external-connection nodes provided on the lower surface of the board, a supporting member provided inside the container part and secured by the board, a semiconductor chip secured on the supporting member and electrically connected with the external-connection nodes, and a sealing resin fully filling the container part so as to completely cover the semiconductor chip.

REFERENCES:
patent: 5193053 (1993-03-01), Sonobe
patent: 5216278 (1993-06-01), Lin et al.
patent: 5241133 (1993-08-01), Mullen, III et al.
patent: 5294827 (1994-03-01), McShane
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5404273 (1995-04-01), Akagawa
patent: 5455456 (1995-10-01), Newman

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