4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Multiple housings

Ichiro Yamaguchi

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Bump-forming method using two plates and electronic device

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Bump-forming method using two plates and electronic device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Drive control device for hybrid vehicle

Motor vehicles – Power – Electric
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Drive force control for hybrid electric vehicle

Data processing: vehicles – navigation – and relative location – Vehicle control – guidance – operation – or indication – Electric vehicle
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Drive force distribution system for four wheel independent...

Data processing: vehicles – navigation – and relative location – Vehicle control – guidance – operation – or indication – Control of power distribution between vehicle axis or wheels
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Profile ID: LFUS-PAI-P-132721

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