Semiconductor device manufacturing: process – Making passive device
Reexamination Certificate
2011-06-07
2011-06-07
Richards, N Drew (Department: 2895)
Semiconductor device manufacturing: process
Making passive device
C257S531000, C336S200000
Reexamination Certificate
active
07955942
ABSTRACT:
A semiconductor device is made by mounting a semiconductor die over a carrier. A ferromagnetic inductor core is formed over the carrier. A prefabricated pillar frame is formed over the carrier, semiconductor die, and inductor core. An encapsulant is deposited over the semiconductor die and inductor core. A portion of the pillar frame is removed. A remaining portion of the pillar frame provides an interconnect pillar and inductor pillars around the inductor core. A first interconnect structure is formed over a first surface of the encapsulant. The carrier is removed. A second interconnect structure is formed over a second surface of the encapsulant. The first and second interconnect structures are electrically connected to the inductor pillars to form one or more 3D inductors. In another embodiment, a shielding layer is formed over the semiconductor die. A capacitor or resistor is formed within the first or second interconnect structures.
REFERENCES:
patent: 3881244 (1975-05-01), Kendall
patent: 5250843 (1993-10-01), Eichelberger
patent: 5353498 (1994-10-01), Fillion et al.
patent: 5841193 (1998-11-01), Eichelberger
patent: 7081803 (2006-07-01), Takaya et al.
patent: 7229908 (2007-06-01), Drizlikh et al.
patent: 7619901 (2009-11-01), Eichelberger et al.
patent: 2003/0112114 (2003-06-01), Long et al.
patent: 2004/0124961 (2004-07-01), Aoyagi
patent: 2007/0085648 (2007-04-01), Lee et al.
patent: 2007/0236319 (2007-10-01), Hsu et al.
patent: 2008/0135977 (2008-06-01), Meyer et al.
patent: 2009/0085704 (2009-04-01), Theuss
patent: 2009/0188104 (2009-07-01), Ching et al.
patent: 2010/0308434 (2010-12-01), Ikeda et al.
Lin Yaojian
Pagaila Reza A.
Atkins Robert D.
Bradford Peter
Patent Law Group
Richards N Drew
STATS ChipPAC Ltd.
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