Semiconductor device and method of fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S408000, C257SE29278, C438S306000, C438S508000

Reexamination Certificate

active

07321151

ABSTRACT:
An extension region is formed by ion implantation under masking by a gate electrode, and then a substance having a diffusion suppressive function over an impurity contained in a source-and-drain is implanted under masking by the gate electrode and a first sidewall spacer so as to form amorphous layers a semiconductor substrate within a surficial layer thereof and in alignment with the first sidewall spacer, to thereby form an amorphous diffusion suppressive region.

REFERENCES:
patent: 5903029 (1999-05-01), Hayashida et al.
patent: 6207519 (2001-03-01), Kim et al.
patent: 6274906 (2001-08-01), Kim et al.
patent: 6555439 (2003-04-01), Xiang et al.
patent: 2003/0146458 (2003-08-01), Horiuchi et al.
patent: 2004/0266122 (2004-12-01), Cheng et al.
patent: 10-125916 (1998-05-01), None
patent: 2003-229568 (2003-08-01), None
patent: 2004-342908 (2004-12-01), None
Patent Abstracts of Japan, Publication No. 61018176, dated Jan. 27, 1986.
Patent Abstracts of Japan, Publication No. 11186188, dated Jul. 9, 1999.
Office Action dated May 1, 2007, issued in corresponding Japanese Appl. No. 2003-373499.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and method of fabricating the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and method of fabricating the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method of fabricating the same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2760211

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.