Semiconductor device and method for manufacturing the same

Details Semiconductor device and method for manufacturing the same Semiconductor device and method for manufacturing the same

2007-08-16

2010-06-22

Le, Thao X (Department: 2892)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S774000

Reexamination Certificate

active

07741212

ABSTRACT:
A semiconductor device and method for manufacturing the same are provided, capable of narrowing feature size by utilizing the property of oxidation of a material. In one method, a polysilicon layer can be patterned into a fine pattern up to a critical dimension using a photolithography process. Then the patterned polysilicon layer can be oxidized, thereby narrowing the gap between adjacent polysilicon patterns and narrowing the polysilicon patterns through the oxidation process. The narrowed polysilicon patterns and/or the narrowed gap between adjacent polysilicon patterns can be used to form vias or trenches in the substrate (or layer) below the polysilicon layer having a width narrower than the critical dimension.

REFERENCES:
patent: 6171903 (2001-01-01), Chiou
patent: 6204109 (2001-03-01), Wu
patent: 2004/0099925 (2004-05-01), Poveda
patent: 1987-0111826 (1988-11-01), None
patent: 10-1991-0017725 (1994-10-01), None

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