Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...
Reexamination Certificate
2006-02-14
2006-02-14
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With large area flexible electrodes in press contact with...
C257S698000, C257S692000, C257S685000, C257S686000
Reexamination Certificate
active
06998704
ABSTRACT:
A semiconductor device is provided including a semiconductor element having a circuit and at least one electrode of the circuit, a flexible substrate having at least one electrode pad and surrounding the semiconductor element, a conductor for connecting the electrode with the electrode pad, and a plurality of solder bumps on the electrode pad, wherein at least a first portion between a surface facing the solder bumps of the semiconductor element and the flexible substrate is not fixed by adhesion.
REFERENCES:
patent: 6376769 (2002-04-01), Chung
patent: 8-335663 (1996-12-01), None
patent: 2001-196504 (2001-07-01), None
Hazeyama Ichiro
Inoue Hirobumi
Kitajo Sakae
Kubo Masahiro
Kuroda Hidehiko
Clark Jasmine
NEC Corporation
LandOfFree
Semiconductor device and method for manufacturing the same,... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device and method for manufacturing the same,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method for manufacturing the same,... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3638838