Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate
1999-09-22
2001-06-12
Lee, Eddie C. (Department: 2812)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
C257S673000, C257S676000
Reexamination Certificate
active
06246109
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates to a semiconductor device and a method for fabricating the same, more particularly to a semiconductor device and a method for fabricating the same that can enhance production yield and that can reduce production costs.
2. Description of the Related Art
Referring to
FIGS. 1
to
4
, a conventional method for fabricating a semiconductor device is shown. As shown in
FIG. 1
, a die
10
having an upper surface provided with a plurality of solder pads
100
is attached to a tie bar
130
on a lead frame
13
by means of a double-side adhesive tape
12
to fix the die
10
on the lead frame
13
. The solder pads
100
are exposed via a bore
1300
formed in the tie bar
130
, as shown in FIG.
4
. Referring to
FIG. 2
, each of the solder pads
100
is connected electrically to a respective lead
131
of the lead frame
13
via known wire bonding techniques by means of a conductive wire
14
that extends through the bore
1300
. Referring to
FIG. 3
, a plastic protective layer
15
formed from a moulding compound is used to encapsulate the die
10
and a portion of the lead frame
13
to form the semiconductor device.
The following are some of the drawbacks of the conventional method for fabricating the semiconductor device:
1. The aforesaid method needs conductive wires
14
for connecting electrically the solder pads
100
and the leads
131
, respectively, thereby requiring an expensive wire bonder that leads to higher fabricating costs.
2. In the aforesaid method, because there is a height difference between the solder pads
100
and the leads
131
, wire bonding is unstable and inconvenient to conduct, thereby resulting in a relatively low production yield.
3. In the aforesaid method, when the die
10
needs to be inspected, it will take a relatively long time to remove the plastic protective layer
15
from the die
10
, thereby further increasing the fabricating costs.
SUMMARY OF THE INVENTION
Therefore, the object of the present invention is to provide a semiconductor device and a method for fabricating the same which can overcome the drawbacks associated with the aforesaid prior art.
According to one aspect of the present invention, a semiconductor device includes a lead frame, a dielectric tape layer, a plurality of conductive contacts and a semiconductor die.
The lead frame is provided with a plurality of leads.
The dielectric tape layer has a first adhesive surface adhered onto the leads, and a second adhesive surface opposite to the first adhesive surface. The dielectric tape layer is formed with a plurality of holes at positions registered with the leads for access thereto. Each of the holes is confined by a wall that cooperates with a registered one of the leads to form a contact receiving space.
The conductive contacts are placed in the contact receiving spaces, respectively.
The die has a die mounting surface adhered onto the second adhesive surface of the dielectric tape layer. The die mounting surface is provided with a plurality of contact pads that are bonded to the conductive contacts to establish electrical connection with the leads of the lead frame.
According to another aspect of the present invention, a method for fabricating the semiconductor device comprises:
adhering a first adhesive surface of a dielectric tape layer on a plurality of leads that are provided on a lead frame, the dielectric tape layer being formed with a plurality of holes at positions registered with the leads for access thereto, each of the holes being confined by a wall that cooperates with a registered one of the leads to form a contact receiving space;
placing a plurality of conductive contacts in the contact receiving spaces, respectively; and
adhering a die mounting surface of a semiconductor die onto a second adhesive surface of the dielectric tape layer opposite to the first adhesive surface, and bonding a plurality of contact pads that are provided on the die mounting surface of the semiconductor die to the conductive contacts to establish electrical connection with the leads of the lead frame.
REFERENCES:
patent: 4303934 (1981-01-01), Stitt
patent: 5559366 (1996-09-01), Fogal et al.
patent: 5892271 (1999-04-01), Takeda et al.
patent: 6013944 (2000-01-01), Moriya et al.
patent: 6114013 (2000-09-01), Hotta
patent: 0 475 022 (1992-03-01), None
patent: 63-209152 (1988-08-01), None
patent: 8306840 (1995-11-01), None
patent: 8264706 (1996-10-01), None
Cruz Lourdes
Lee Eddie C.
Merchant & Gould P.C.
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