Semiconductor device and method for fabricating the same

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S259000, C438S271000, C438S589000, C257SE21419, C257SE21384

Reexamination Certificate

active

10986495

ABSTRACT:
Described is a method for fabricating a semiconductor device having an FET of a trench-gate structure obtained by disposing a conductive layer, which will be a gate, in a trench extended in the main surface of a semiconductor substrate, wherein the upper surface of the trench-gate conductive layer is formed higher than the main surface of the semiconductor substrate and the trench gate conductive layer and gate insulating film are formed in the trench and over the main surface of the semiconductor substrate at the periphery of the trench. In this method, a trench wherein a trench-gate is to be formed is formed on the main surface of the semiconductor substrate with the insulating film formed thereon with a mask; and the side surface of the insulating film is caused to retreat from the upper end of the trench by isotropic etching, whereby a gate insulating film and a conductive layer to be the trench gate are formed in the trench and over the main surface of the semiconductor substrate at the periphery of the trench. According to the present invention, occurrence of a source offset and damage of a gate insulating film can be prevented.

REFERENCES:
patent: 3975221 (1976-08-01), Rodgers
patent: 4003126 (1977-01-01), Holmes et al.
patent: 4084175 (1978-04-01), Ouyang
patent: 4272302 (1981-06-01), Jhabvala
patent: 4767722 (1988-08-01), Blanchard
patent: 5258332 (1993-11-01), Horioka et al.
patent: 5366914 (1994-11-01), Takahashi et al.
patent: 5578508 (1996-11-01), Baba et al.
patent: 5693569 (1997-12-01), Ueno
patent: 5733810 (1998-03-01), Baba et al.
patent: 5744826 (1998-04-01), Takeuchi
patent: 5753554 (1998-05-01), Park
patent: 5783491 (1998-07-01), Nakamura et al.
patent: 5817558 (1998-10-01), Wu
patent: 5970344 (1999-10-01), Kubo et al.
patent: 6307231 (2001-10-01), Numazawa et al.
patent: 6368920 (2002-04-01), Beasom
patent: 6455378 (2002-09-01), Inagawa et al.
patent: 6511886 (2003-01-01), Kim et al.
patent: 63-177565 (1988-07-01), None
patent: 07-045824 (1995-02-01), None
patent: 11-031815 (1999-02-01), None
patent: 11-074514 (1999-03-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and method for fabricating the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and method for fabricating the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method for fabricating the same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3796858

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.