Semiconductor device and method for fabricating the same

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S199000, C257SE27098

Reexamination Certificate

active

07138312

ABSTRACT:
The semiconductor device comprises a gate interconnection24aincluding a gate electrode formed over a semiconductor substrate14with a gate insulation film22formed therebetween; a first source/drain diffused layer28formed near the end of the gate interconnection24a; a second source/drain diffused layer34formed remote from the gate interconnection24aand the first source/drain diffused layer28; and an insulation film40formed over the gate interconnection24a, the first source/drain diffused layer28and the second source/drain diffused layer34, and having a groove-shaped opening42aformed in, which integrally exposes the gate interconnection24a, one of the first source/drain diffused layer28, and one of the second source/drain diffused layer34; and a contact layer48aburied in the groove-shaped opening42a. The groove-shaped openings42afor the contact layers48ato be buried in can be formed without failure. Accordingly, it is possible to provide a semiconductor device which can realize the micronization without reliability decrease and fabrication yield decrease.

REFERENCES:
patent: 6696732 (2004-02-01), Matsuoka et al.
patent: 6765272 (2004-07-01), Natsume
patent: 6812574 (2004-11-01), Tomita et al.
patent: 9-55440 (1997-02-01), None
patent: 9-162354 (1997-06-01), None
patent: 2001-93974 (2001-04-01), None
patent: 2003-45961 (2003-02-01), None
patent: 2003-131400 (2003-05-01), None

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