Semiconductor device and method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Magnetic field

Reexamination Certificate

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Details

C257S422000, C257S531000, C257S774000, C257S775000

Reexamination Certificate

active

07026699

ABSTRACT:
In a semiconductor device having a WCSP type construction package, to increase inductance without increasing further an area conventionally occupied by a coil. A pseudo-post part27comprising a magnetic body is extended in a direction perpendicular to a main surface12aof a semiconductor chip12, on a second insulating layer21of a WCSP10. A first conductive part15aand a second conductive part15bconstructed as square frames are respectively provided so as to surround the pseudo-post part, on respective top surfaces of a second insulation layer and a third insulating layer22which are separated parallel to each other, in an extension direction of the pseudo-post part. A coil100being a substantially spiral shape conductive path is formed from, the first conductive part, the second conductive part, and a connection part26which electrically connects the one ends of the first and second conductive parts.

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patent: 4-184834 (1992-07-01), None
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patent: 2002-164468 (2002-06-01), None

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