4. Electricity: electrical systems and devices
  5. Housing or mounting assemblies with diverse electrical...
  6. For electronic systems and devices

Noritaka Anzai

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Bond pad for stress releif between a substrate and an...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Reexamination Certificate

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Method of manufacturing semiconductor devices having solder...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Resin sealed-type semiconductor device and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Resin sealing type semiconductor device

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Resin-molded semiconductor device that includes at least one...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1030493

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