Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate
2007-03-20
2007-03-20
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With specified encapsulant
C257S787000, C257S788000, C257S793000, C257SE31117, C257SE23116, C257SE21502, C257SE21504
Reexamination Certificate
active
11132292
ABSTRACT:
One of the aspects of the present invention is to provide a semiconductor device, which includes a circuit board, a first semiconductor chip mounted on the circuit board, a built-in semiconductor package on the first semiconductor chip, and a first molded resin encompassing the first semiconductor chip and the built-in semiconductor package. The built-in semiconductor package includes at least one second semiconductor chip mounted on a die pad, and the second semiconductor chip has a plurality of terminals. Also, the built-in semiconductor package includes a plurality of lead frames, and each of the lead frames is electrically connected with respective one of the terminals of the second semiconductor chip, and has a connection region on one side and a support region on the other opposing side. Further, the built-in semiconductor package a second molded resin encompassing the die pad, the second semiconductor chip, and the lead frames so that each of the connection regions is exposed and each of the support regions is covered. While the second molded resin has top and bottom surfaces, a plane flush with the connection region locates between the top and bottom surfaces of the second molded resin.
REFERENCES:
patent: 5780925 (1998-07-01), Cipolla et al.
patent: 6650020 (2003-11-01), Yamada et al.
patent: 6953988 (2005-10-01), Seo et al.
patent: 7091623 (2006-08-01), Tsai et al.
patent: 2002/0020923 (2002-02-01), Kanatake
patent: 2002/0079590 (2002-06-01), Nataoka et al.
patent: 11-288977 (1999-10-01), None
Clark Jasmine
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Renesas Technology Corp.
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