Semiconductor device and manufacturing method thereof

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S270000, C438S272000, C438S369000, C257S330000, C257S335000, C257S492000, C257S506000, C257SE21410, C257SE21418, C257SE23009, C257SE29262

Reexamination Certificate

active

07897459

ABSTRACT:
A through electrode is formed prior to fabricating a semiconductor device by using a standard manufacturing method. Aside face of the through electrode is insulated from a semiconductor substrate by an insulating film, while the top face thereof is covered with a protective insulating film. These insulating films covering the through electrode protect a conductor of the through electrode and prevent emission of a contaminant from the conductor. Standard manufacturing conditions can be applied without change.

REFERENCES:
patent: 6376314 (2002-04-01), Jerred
patent: 2008/0160697 (2008-07-01), Kao
patent: 2009/0174080 (2009-07-01), Saito et al.
patent: 2003-332417 (2003-11-01), None
patent: 2004-221350 (2004-08-01), None
patent: 2005-38942 (2005-02-01), None
patent: 2005-236271 (2005-09-01), None
patent: 2005-243689 (2005-09-01), None
patent: 2006-19431 (2006-01-01), None
patent: 2006-19455 (2006-01-01), None
patent: 2006-114686 (2006-04-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and manufacturing method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and manufacturing method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and manufacturing method thereof will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2676422

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.