Semiconductor device and manufacturing method thereof

Details Semiconductor device and manufacturing method thereof Semiconductor device and manufacturing method thereof

2007-12-25

2007-12-25

Nguyen, Tuan H. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S460000

Reexamination Certificate

active

10910805

ABSTRACT:
A manufacturing method of a semiconductor device formed in a chip size package is improved to enhance a yield and reliability. A window to expose first wirings is formed only in a region of a semiconductor substrate where the first wirings exist. As a result, area of the semiconductor substrate bonded to a supporting body through an insulation film and a resin is increased to prevent cracks in the supporting body and separation of the semiconductor substrate from the supporting body. A slit is formed along a dicing line after forming the window, the slit is covered with a protection film and then the semiconductor substrate is diced into individual semiconductor dice. Thus, separation on a cut surface or at an edge of the semiconductor dice, which otherwise would be caused by contact of the blade in the dicing can be prevented.

REFERENCES:
patent: 6316287 (2001-11-01), Zandman et al.
patent: 2004/0161920 (2004-08-01), Noma
patent: 2004/0235270 (2004-11-01), Noma et al.
patent: 09-063993 (1997-03-01), None
patent: 2002-512436 (2002-04-01), None
patent: 99/40624 (1999-08-01), None

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