Semiconductor device and manufacturing method thereof...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S287000, C438S597000, C438S786000, C438S788000

Reexamination Certificate

active

07129125

ABSTRACT:
A semiconductor device comprises a semiconductor region including silicon, and an insulating film including silicon, oxygen, nitrogen, and helium, the dielectric film provided on the semiconductor region, and the dielectric film having a concentration distribution with respect to a film thickness direction, the concentration distribution having a maximal value of concentration of the helium in a surface portion on the semiconductor region side and a maximal value of concentration of the nitrogen in a surface portion on a side opposite to the semiconductor region.

REFERENCES:
patent: 6649538 (2003-11-01), Cheng et al.
patent: 6800519 (2004-10-01), Muraoka et al.
patent: 6-69198 (1994-03-01), None
patent: 10-209449 (1998-08-01), None
patent: 2002-222941 (2002-08-01), None
Stanley Wolf Ph.D. and Richard N. Tauber Ph.D. in Silicon Processing for the VLSI Era, vol. 1: Process Technology, Lattice Press, 1986, pp. 242-61.
Yasuda, Y. et al., “Radical Nitridation in Multi-Oxide Process for 100nm Generation CMOS Technology”, 2001 Symposium on VLSI Technology Digest of Technical Papers, 2 pages, (2001).
Chen, C. H. et al., “Downscaling Limit of Equivalent Oxide Thickness in Formation of Ultrathin Gate Dielectric by Thermal-Enhanced Remote Plasma Nitridation”, IEEE Transactions on Electron Devices, vol. 49, No. 5, pp. 840-846, (May 2002).
Notification of Reasons for Rejection in Japanese Patent App. No. 2003-49611, mailed Jan. 31, 2006 (4 pages).

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