Semiconductor device and manufacturing method therefor,...

Details Semiconductor device and manufacturing method therefor,... Semiconductor device and manufacturing method therefor,...

2005-02-08

2005-02-08

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S639000, C438S640000, C438S667000

Reexamination Certificate

active

06852621

ABSTRACT:
A method of manufacturing a semiconductor device comprises a step of forming a through-hole in a semiconductor chip having an electrode and forming a conductive layer on a region comprising an inner side of the through-hole. An intermediate portion of the through-hole is formed to be larger than an edge portion thereof, and the conductive layer is formed by electroless plating.

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IBM Technical Bulletin, vol. 34, Issue No. 34, pp. 416-418, Dec. 1, 1991.

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