Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – By reaction with substrate
Patent
1997-12-02
2000-12-19
Fourson, George
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
By reaction with substrate
438592, H01L 218232
Patent
active
061627410
ABSTRACT:
According to the manufacturing method of the semiconductor device of the present invention, an oxide film is formed on a metal film formed on a main surface of a semiconductor substrate by exposing the metal film to the oxidizing gas. The oxide film is then reduced in a reducing atmosphere, and a protection film is formed on the surface of the metal film reduced in the reducing step. In this manner, the damage to the surface of the metal film can be prevented.
REFERENCES:
patent: 4074300 (1978-02-01), Sakai et al.
patent: 4505028 (1985-03-01), Kobayashi et al.
patent: 5907188 (1999-05-01), Nakajima et al.
Akasaka Yasushi
Miyano Kiyotaka
Nakajima Kazuaki
Suguro Kyoichi
Abbott Barbara Elizabeth
Fourson George
Kabushiki Kaisha Toshiba
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