Semiconductor device and manufacturing method of the same

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438300, H01L 21336

Patent

active

058720391

ABSTRACT:
The present invention discloses a MOS transistor which is capable of reducing an area of a diffusion layer of a source and drain, and is capable of reducing the number of manufacturing processes while enhancing flatness of a surface of the device. A selective silicon epitaxial layer is formed in an element region which is defined by an element isolation insulating layer formed in a silicon substrate. In the element isolation insulation layer, a polysilicon layer and a selective polysilicon layer connected to the selective silicon epitaxial layer are formed as a source and drain electrode. An LDD region and a source and drain region are formed in the selective silicon epitaxial layer, and a leading electrode for the source and drain region is formed in the source and drain electrode. The source and drain electrode can be formed by one photolithography process, and a margin between the gate electrode and the element isolation insulating layer can be reduced, whereby an area of a diffusion layer of the source and drain is reduced.

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European Search Report, dated Jun. 23, 1997.
"High Performance FET Structure Made Using Medium to Low Temperature Epitaxy", IBM Technical Disclosure Bulletin, vol. 33, No. 11, Apr. 1991, pp. 53-55.
J. M. Sung et al.; "A High Performance Super Self-Aligned 3 V/5 V BiCMOS Technology . . . Applications"; IEEE Transactions on Electron Devices, vol. 42, No. 3, Mar. 1995, pp. 513-522.

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