Semiconductor device and hybrid integrated circuit device

Details Semiconductor device and hybrid integrated circuit device Semiconductor device and hybrid integrated circuit device

2006-09-05

2006-09-05

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S672000, C257S695000, C257S696000

Reexamination Certificate

active

07102211

ABSTRACT:
The related arts have difficulty in efficiently dissipating the heat generated by a resin-molded semiconductor element, and thus have the problem of thermal stress causing damage to the semiconductor element. To solve the problem, a semiconductor device of the preferred embodiments includes common leads coupled to an island, and a part of the common leads projects out from a resin seal body. The projecting common leads have a coupling portion. When mounting the semiconductor device, the common leads are bridged with brazing material. Thus, the heat generated by an integrated circuit chip mounted on the island is dissipated through the common leads to the outside of the resin seal body. In the preferred embodiments of the invention, a further improvement in heat dissipation characteristics can be accomplished by increasing the surface areas of the common leads.

REFERENCES:
patent: 4482915 (1984-11-01), Nishikawa et al.
patent: 5495125 (1996-02-01), Uemura
patent: 5903050 (1999-05-01), Thurairajaratnam et al.

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