Semiconductor device and fabricating method thereof

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S303000, C438S595000, C257SE21626, C257SE21640, C257SE21659

Reexamination Certificate

active

07148113

ABSTRACT:
A method for fabricating a semiconductor device is described. A gate dielectric layer is formed on a substrate, and several gate structures having a gate conductor, a cap layer and spacers are formed on the gate dielectric layer. A mask layer is formed over the substrate covering a portion of the gate structures. Removing the cap layer and spacers that are not covered by the mask layer. After the mask layer is removed, a dielectric layer is formed over the substrate covering the gate structures. A self-aligned contact hole is formed in the dielectric layer. A conductive layer is formed in the self-aligned contact hole and on the dielectric layer. Since the cap layer and spacers that are not covered by the mask layer are removed and substituted by the dielectric layer having lower dielectric constant property, the parasitic capacitance can be reduced.

REFERENCES:
patent: 6137126 (2000-10-01), Avanzino et al.
patent: 6218272 (2001-04-01), Yeom et al.
patent: 6630721 (2003-10-01), Ligon
patent: 2002/0163036 (2002-11-01), Miura et al.
patent: 2002/0175385 (2002-11-01), Jin et al.
patent: 2002/0195686 (2002-12-01), Kim et al.
patent: 2003/0052353 (2003-03-01), Fujiwara et al.
patent: 2005/0017280 (2005-01-01), Lee
patent: 2005/0020009 (2005-01-01), Tobben

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and fabricating method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and fabricating method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and fabricating method thereof will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3710013

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.