Semiconductor device and a method for manufacturing thereof

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438264, 438265, 438287, H01L 21336

Patent

active

061301302

ABSTRACT:
An ONO layer 18 located vicinity of a transistor TR1 for programming is removed. A floating gate FG1 of the transistor TR1 is formed by carrying out etching of a polysilicon layer 16. Then, an inter-layer film SM1 of the transistor TR1 is formed by carrying out oxidation process. The inter-layer film SM1 is formed so as to cover the floating gate FG1. Arsenic is implanted ionically into a semiconductor-substrate 12 using the floating gate FG1 and the inter-layer film SM1 as a mask. Ions of the arsenic thus implanted do not pass through the inter-layer film SM1 and are stopped at the surface. Because the inter-layer film SM1 is made of a silicon oxidation layer formed relatively thick. So that, the inter-layer film SM1 maintains its charge-storage characteristic originally owns even when the ion implantation is carried out.

REFERENCES:
patent: 5278087 (1994-01-01), Jenq
patent: 5557123 (1996-09-01), Ohta
patent: 5587603 (1996-12-01), Kowshik
patent: 5633520 (1997-05-01), Wu et al.
patent: 5658813 (1997-08-01), Enomoto
patent: 5668034 (1997-09-01), Sery et al.
patent: 5789294 (1998-08-01), Choi
patent: 5879990 (1999-03-01), Dormans et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and a method for manufacturing thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and a method for manufacturing thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and a method for manufacturing thereof will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2255947

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.