Semiconductor device and a manufacturing method of the same

Details Semiconductor device and a manufacturing method of the same Semiconductor device and a manufacturing method of the same

2008-07-15

2008-07-15

Smith, Matthew S. (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S786000, C257SE23021

Reexamination Certificate

active

11482764

ABSTRACT:
By preparing a package substrate which has a plurality of lands of NSMD structure, and the output wiring and dummy wiring which were connected to each of the lands, and have been arranged mutually in location of 180° symmetry, and printing solder by a printing method to the lands after the package assembly, the variation in the height of the solder coat between lands can be reduced, and improvement in the mountability of LGA (semiconductor device) is achieved.

REFERENCES:
patent: 6943100 (2005-09-01), Chinda et al.
patent: 2004/0043537 (2004-03-01), Tomihara
patent: 9-232736 (1997-09-01), None
patent: 2000-031630 (2000-01-01), None

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