Semiconductor device

Details Semiconductor device Semiconductor device

1997-03-28

2000-01-25

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257780, 257783, 257778, H01L 3900, H01L 2348, H01L 2352, H01L 2940

Patent

active

060181885

ABSTRACT:
Electrode pads 6a are provided in the central portion of a semiconductor element 5, and the semiconductor element 5, which is mounted on a TCP tape 1 without device holes in this TCP tape, is mounted on the surface side of the TCP tape. In addition, the internal ends 2a of the wiring films 2 provided on the surface of the TCP tape 1 are extended all the way to the central portion of the semiconductor element 5 in conformity with these electrode pads 6a. The outside extension can be reduced and the TCP tape 1 shortened even when the wiring films 2 have the required length. In addition, the absence of device holes dispenses with the costs associated with punching out of the device holes, improves the mechanical strength of the wiring films 2, and enhances the holding force of the semiconductor element.

REFERENCES:
patent: 3868724 (1975-02-01), Perrino
patent: 5040588 (1991-08-01), Newkirk et al.
patent: 5119864 (1992-06-01), Langensiepen et al.
patent: 5163499 (1992-11-01), Newkirk et al.
patent: 5249621 (1993-10-01), Aghajaniam et al.
patent: 5394930 (1995-03-01), Kennerknecht
patent: 5616421 (1997-04-01), Sawtell et al.
patent: 5618635 (1997-04-01), Newkirk et al.

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