Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

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Details

257690, 257693, 257737, 257778, H01L 23495

Patent

active

058959653

ABSTRACT:
In order to provide a semiconductor device of high reliability which suppresses a degradation of the fatigue strength of solder connection portions and warping of a tape-type wiring substrate forming the cause of the inferior contact between solder bumps and an external substrate, and a method of manufacturing the semiconductor device, a frame-like member is disposed on the inner peripheral part of the tape-type wiring substrate so as to relax constraint on the thermal deformation of the tape-type semiconductor substrate.

REFERENCES:
patent: 5216278 (1993-06-01), Lin et al.
patent: 5420460 (1995-05-01), Massingill

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