Semiconductor device

Details Semiconductor device Semiconductor device

1992-10-13

1994-03-08

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257698, H01L 3902, H01L 2312, H01L 2314

Patent

active

052930688

ABSTRACT:
An encapsulated semiconductor device has a chip, a chip pad having through holes and also conducting patterns corresponding to an electrode pad of the chip, and leads. An arbitrary external terminal arrangement is obtained by combining a wire bonding operation between the conducting pattern and lead. Wire bonding is advantageously performed between the leads and electrode pads of the semiconductor chip arranged at arbitrary positions. The degree of freedom in designing areas of the chips and also a printed circuit board is improved so that a high packaging density is achieved and furthermore the printed circuit board is made compact.

REFERENCES:
patent: 5159434 (1992-10-01), Kohno et al.

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