Semiconductor device

Details Semiconductor device Semiconductor device

1996-04-18

1999-04-06

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257778, 257780, H01L 23495

Patent

active

058922717

ABSTRACT:
A first bump is arranged on an electrode of a semiconductor chip. An opening portion formed at a position corresponding to an electrode on the semiconductor chip, a conductive lead subjected to patterning and arranged in the opening portion, and a second bump for being connected to the outside of the device are formed on a flexible substrate, and the conductive lead and the first bump are connected to each other in the opening portion. An external shape of the flexible substrate is approximately the same as that of the semiconductor chip.

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patent: 5602419 (1997-02-01), Takeda et al.
patent: 5659952 (1997-08-01), Kovac et al.
patent: 5668405 (1997-09-01), Yamashita

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