Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent
1997-03-19
2000-04-11
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
257777, 257719, 257783, 22818022, H01L 2348, H01L 2352, H01L 2940, H01L 2334
Patent
active
060491280
ABSTRACT:
A semiconductor device, is provided will semiconductor chips having a plurality of electrodes for external connection, elastomer resin portions formed of an elastomer resin, which are bonded to the semiconductor chip excepting at least some of the plurality of electrodes, a tape layer of resin including tape wiring patterns on the surface thereof, a plurality of solder bumps for bonding the printed wiring pattern to the tape wiring patterns, leads for connecting the plurality of electrodes of the semiconductor chips to the tape wiring patterns, and seal resin for covering the leads and the plurality of electrodes which are connected by the leads. The elastomer resin has a modulus of transverse elasticity not less than 50 MPa and not more than 750 MPa.
REFERENCES:
patent: 5576630 (1996-11-01), Fujita
patent: 5737191 (1998-04-01), Horiuchi et al.
Transaction of the Japan Society of Mechanical Engineers (JSME), vol. 50, No. 505, Chapter A, p. 1709.
Kitano et al., "Thermal Fatique S Strength Estimation of Solder Joints of Surface Mount IC Packages", Soldering & Surface Mount Technology, No. 2, Jun. 1989.
Anjoh Ichiro
Eguchi Shuji
Kitano Makoto
Kohno Ryuji
Kumazawa Tetsuo
Clark Jhihan B
Hitachi , Ltd.
Saadat Mahshid D.
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