Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2005-03-15
2005-03-15
Zarabian, Amir (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S737000, C257S738000, C438S108000, C438S613000, C438S617000
Reexamination Certificate
active
06867502
ABSTRACT:
A flip-chip BGA is disclosed which exhibits an excellent high-speed electric transmission characteristic while minimizing the formation of voids in sealing resin filled between a semiconductor chip and a wiring substrate. A silicon chip is flip-chip-mounted on a package substrate, and in a central area of a main surface of the silicon chip are arranged a power supply circuit, an input/output circuit, and plural bonding pads, while in the other area than the central area are arranged solder bumps in a matrix form, the solder bumps being electrically connected to the bonding pads through Cu wiring. Of the solder bumps, solder bumps for input/output power supply and solder bumps for the input and output of a data signal are arranged in a first area adjacent to the central area, and solder bumps for address signal input are arranged in a second area located outside the first area.
REFERENCES:
patent: 5849606 (1998-12-01), Kikuchi et al.
patent: 5862096 (1999-01-01), Yasuda et al.
patent: 6178108 (2001-01-01), Miyatake et al.
patent: 6222272 (2001-04-01), Takayama et al.
patent: 6472745 (2002-10-01), Iizuka
patent: 6477046 (2002-11-01), Stearns et al.
patent: 6563299 (2003-05-01), Van Horn et al.
patent: 20010013662 (2001-08-01), Kudou et al.
patent: 20030112695 (2003-06-01), Fujisawa et al.
patent: 20030151100 (2003-08-01), Toyoshima et al.
patent: 20040007778 (2004-01-01), Shinozaki et al.
patent: 08-097313 (1996-04-01), None
patent: 2001-015554 (2001-01-01), None
Katagiri Mitsuaki
Ujiie Kenji
Usami Masami
Renesas Technology Corp.
Tran Thanh Y.
Zarabian Amir
LandOfFree
Semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3442013