Semiconductor device

Details Semiconductor device Semiconductor device

1998-11-19

2000-08-01

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257737, 257778, H01L 23495

Patent

active

060970820

ABSTRACT:
A ball grid array type semiconductor device comprises a bare chip, metal-filled through hole portions connected to internal electrodes of the bare chip, inner leads and a flexible tape carrier having external electrodes. The internal electrode of the bare chip has a length in a direction perpendicular to a side of the chip, which is three times or more the pitch of adjacent internal electrodes. The through hole portions are connected respectively to the internal electrodes so that the through hole portions are arranged in three or more rows. The inner lead led from the through hole portion in the intermediate row is spaced apart from an adjacent through hole portion so as not to interfere with it.

REFERENCES:
patent: 5334875 (1994-08-01), Sugano et al.
patent: 5663594 (1997-09-01), Kimura
patent: 5726489 (1998-03-01), Matsuda et al.
patent: 5844307 (1998-12-01), Suzuki et al.

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