Semiconductor copper bond pad surface protection

Details Semiconductor copper bond pad surface protection Semiconductor copper bond pad surface protection

2007-04-03

2007-04-03

Chen, Jack (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S779000, C257S734000

Reexamination Certificate

active

11084985

ABSTRACT:
Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.

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