4. Coating processes
  5. Electrical product produced
  6. Metallic compound coating

Nikhil Murdeshwar

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Semiconductor copper band pad surface protection

Coating processes – Electrical product produced – Metallic compound coating
Reexamination Certificate

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Semiconductor copper bond pad surface protection

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Semiconductor copper bond pad surface protection

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Semiconductor copper bond pad surface protection

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Reexamination Certificate

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Semiconductor copper bond pad surface protection

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2434048

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