Condenser microphone assembly

Electrical audio signal processing systems and devices – Electro-acoustic audio transducer – Microphone capsule only

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C381S174000, C381S191000

Reexamination Certificate

active

10818388

ABSTRACT:
A microphone assembly comprising a housing, the housing including an upper lip, a silicon backplate having a top portion, a bottom portion, an annular side portion, a silicon spacer integrally formed with the backplate and comprising at least one protrusion extending from and integral to the top portion of the silicon backplate, the spacer further comprising an insulating layer, such as silicon dioxide or a fluoropolymer. A plurality of openings extend from the top portion of the backplate to the bottom portion of the backplate. A single diaphragm, comprised of metallized polymer film, acts as both a protective environmental barrier and a sensing electrode of a capacitive electroacoustic sensing transducer. A metal ring is positioned against the upper lip of the metal housing. The diaphragm is adhesively affixed to the ring, and the ring, in cooperation with the upper lip and a spring, secure the diaphragm against the insulating layer of the spacer.

REFERENCES:
patent: 4910840 (1990-03-01), Sprenkels
patent: 4993072 (1991-02-01), Murphy
patent: 5146435 (1992-09-01), Bernstein
patent: 5208789 (1993-05-01), Ling
patent: 5316619 (1994-05-01), Mastrangelo
patent: 5490220 (1996-02-01), Loeppert
patent: 5573679 (1996-11-01), Mitchell
patent: 5596222 (1997-01-01), Bernstein
patent: 5740261 (1998-04-01), Loeppert
patent: 5745438 (1998-04-01), Hill
patent: 5753819 (1998-05-01), Rozgo
patent: 5854846 (1998-12-01), Beavers
patent: 5870482 (1999-02-01), Loeppert
patent: 5888845 (1999-03-01), Bashir et al.
patent: 5889872 (1999-03-01), Sooriakumar
patent: 6012335 (2000-01-01), Bashir
patent: 6075867 (2000-06-01), Bay
patent: 6088463 (2000-07-01), Rombach
patent: 6097821 (2000-08-01), Yokoyama
patent: 6243474 (2001-06-01), Tai
patent: WO 97/01258 (1997-01-01), None
patent: WO 98/13934 (1998-04-01), None
patent: WO 00/09440 (2000-02-01), None
patent: WO 00/12427 (2000-03-01), None
patent: WO 00/62580 (2000-10-01), None
S. Bouwstra et al., “Silicon Microphones-A Danish Perspective”, Journal of Micromechanics and Microengineering Structures, Devices and Systems, vol. 8, 1998 pp. 64-68.
A. Dehe′ et al., “Silicon Micromachined Microphone Chip at Siemens”, Collected Papers: 137thMeeting of the Acoustical Society of America and the 2nd Convention of the European Acoustics Association, 1999.
M. Fischer et al., “Silicon Microphones: An Overview”, Collected Papers: 137thMeeting of the Acoustical Society of America and the 2ndConvention of the European Acoustics Association, 1999.
P. C. Hsu et al., “A High Sensitivity Polysilicon Diaphragm Condenser Microphone”, Digest Workshop on MEMS, Jan. 1998, pp. 580-585.
A. E. Kabir et al., “High Sensitivity Acoustic Transducers with Thin p + Membranes and Gold Back-Plate”, Sensors and Actuators A, vol. 78, 1999, pp. 138-142.
J. Wilkinson, “Packaging and Interconnect Innovation in Microsystems”, Proceedings 13thInternational Conference on Microelectornics and Micropackaging, Aug. 1998, pp. 138-143.
Pirmin Rombach et al., “A Low-Voltage Silicon Condenser Microphone for Hearing Instrument Applications”, Collected Papers: 137thMeeting of the Acoustical Society of America and the 2ndConvention of the European Acoustics Association, 1999.
David Schafer et al., “Micromachined Condenser Microphone for Hearing Aid Use”, Solid-State Sensor and Actuator Workshop, Jun. 1998, pp. 27-30.
Altti Torkkeli, et al., “Capacitive Microphone with Low-Stress Polysilicon Membrane and High-Stress Polysilicon Backplate”, Eurosensors XIII, The Hague, Netherlands, Sep. 1999, pp. 57-60.
R. Mehalso et al., “MEMS Packaging/Interconnects Challenges and Opportunities”, Proceedings InterPACK '97: Advances in Electronic Packaging, vol. 1, 1997, pp. 463-466.
Gerhard M. Sessler, “Silicon Microphones”, Journal of the Audio Engineering Society, vol. 44, No. ½, 1996, pp. 16-22.
Mark Sheplak et al., “A Wafer-Bonded, Silicon-Nitride Membrane Microphone With Dielectrically-Isolated, Singe-Crystal Silicon Piezoresistors”, Solid-State Sensor and Actuator Workshop, Jun. 1998, pp. 23-26.
Xing Yang et al., “Strength of Surface Micromachined Diaphragms”, Materials Research Society Symposium Proceedings, vol. 518, 1998, pp. 93-97.
Quanbo Zou et al., “Silicon Capacitive Microphones with Corrugated Diaphragms”, Collected Papers: 137thMeeting of the Acoustical Society of America and the 2ndConvention of the European Acoustics Association, 1999.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Condenser microphone assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Condenser microphone assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Condenser microphone assembly will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3729914

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.