Semiconductor copper bond pad surface protection

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

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Details

C257S778000, C257S784000, C257S785000, C438S612000, C438S613000, C228S015100, C228S120000, C228S127000, C228S262310

Reexamination Certificate

active

06885104

ABSTRACT:
Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.

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