Semiconductor component, particularly a micromechanical...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation

Reexamination Certificate

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Details

C257S108000, C257S415000, C257S536000

Reexamination Certificate

active

07057248

ABSTRACT:
A semiconductor component, in particular a micromechanical pressure sensor based on silicon, having a base layer, an at least largely self-supporting diaphragm and an overlayer situated on the diaphragm, the diaphragm and the base layer, at least from place to place, delimiting a void. Furthermore, at least from place to place, above the diaphragm a conducting region is provided in the overlayer which is electrically poorly conductive as compared to the conducting region, to which the surface of the diaphragm that faces the overlayer is able to be electrically contacted.

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patent: 5209119 (1993-05-01), Polla et al.
patent: 5242863 (1993-09-01), Xiang-Zheng et al.
patent: 5344523 (1994-09-01), Fung et al.
patent: 5445991 (1995-08-01), Lee
patent: 5511428 (1996-04-01), Goldberg et al.
patent: 6159762 (2000-12-01), Scheiter et al.
patent: 100 32 579 (2002-01-01), None
patent: 0 941 460 (2000-05-01), None
patent: 1 114988 (2001-07-01), None

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