Semiconductor component having stacked, encapsulated dice...

Details Semiconductor component having stacked, encapsulated dice... Semiconductor component having stacked, encapsulated dice...

2007-06-05

2007-06-05

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE25031, C257SE23042, C257SE23126, C257SE25011, C257SE25023, C257SE25013, C257S777000, C257S723000, C257S685000, C257S784000, C257S786000, C257S789000, C257S788000, C257S790000, C257S724000

Reexamination Certificate

active

11205572

ABSTRACT:
A semiconductor component includes a substrate and multiple stacked, encapsulated semiconductor dice on the substrate. A first die is back bonded to the substrate and encapsulated in a first encapsulant, and a second die is back bonded to the first encapsulant. The first encapsulant has a planar surface for attaching the second die, and can also include locking features for the second die. The component also includes a second encapsulant encapsulating the second die and forming a protective body for the component. A method for fabricating the component includes the steps of attaching the first die to the substrate, forming the first encapsulant on the first die, attaching the second die to the first encapsulant, and forming the second encapsulant on the second die.

REFERENCES:
patent: 5384480 (1995-01-01), Naka et al.
patent: 5784261 (1998-07-01), Pedder
patent: 5973396 (1999-10-01), Farnworth
patent: 6013948 (2000-01-01), Akram et al.
patent: 6020629 (2000-02-01), Farnworth et al.
patent: 6051886 (2000-04-01), Fogal et al.
patent: 6235554 (2001-05-01), Akram et al.
patent: 6303981 (2001-10-01), Moden
patent: 6316840 (2001-11-01), Otani
patent: 6331453 (2001-12-01), Bolken et al.
patent: 6339255 (2002-01-01), Shin
patent: 6368896 (2002-04-01), Farnworth et al.
patent: 6399416 (2002-06-01), Wark
patent: 6407456 (2002-06-01), Ball
patent: 6451624 (2002-09-01), Farnworth et al.
patent: 6458625 (2002-10-01), Akram
patent: 6489678 (2002-12-01), Joshi
patent: 6501165 (2002-12-01), Farnworth et al.
patent: 6506625 (2003-01-01), Moden
patent: 6507114 (2003-01-01), Hui et al.
patent: 6518186 (2003-02-01), Wensel
patent: 6531338 (2003-03-01), Akram et al.
patent: 6531763 (2003-03-01), Bolken et al.
patent: 6531766 (2003-03-01), Taniguchi et al.
patent: 6541871 (2003-04-01), Pai et al.
patent: 6543512 (2003-04-01), Hamren
patent: 6552910 (2003-04-01), Moon et al.
patent: 6560117 (2003-05-01), Moon
patent: 6569709 (2003-05-01), Derderian
patent: 6570249 (2003-05-01), Liao et al.
patent: 6579399 (2003-06-01), Hamren
patent: 6582992 (2003-06-01), Poo et al.
patent: 6607937 (2003-08-01), Corisis
patent: 6611052 (2003-08-01), Poo et al.
patent: 6614104 (2003-09-01), Farnworth et al.
patent: 6621172 (2003-09-01), Nakayama et al.
patent: 6706557 (2004-03-01), Koopmans
patent: 6731010 (2004-05-01), Horiuchi et al.
patent: 6740546 (2004-05-01), Corisis et al.
patent: 6767767 (2004-07-01), Hayashida et al.
patent: 6774471 (2004-08-01), Chee
patent: 6781222 (2004-08-01), Wu et al.
patent: 6781240 (2004-08-01), Choi
patent: 6815746 (2004-11-01), Suzuki et al.
patent: 6853064 (2005-02-01), Bolken et al.
patent: 6861288 (2005-03-01), Shim et al.
patent: 6906408 (2005-06-01), Cloud et al.
patent: 6992396 (2006-01-01), Arai et al.
patent: 7008822 (2006-03-01), Bolken et al.
patent: 7091623 (2006-08-01), Tsai et al.
patent: 7109576 (2006-09-01), Bolken et al.
patent: 2002/0079567 (2002-06-01), Lo et al.
patent: 2002/0140085 (2002-10-01), Lee et al.
patent: 2002/0175401 (2002-11-01), Huang et al.
patent: 2003/0011067 (2003-01-01), Kimura
patent: 2003/0042615 (2003-03-01), Jiang et al.
patent: 2003/0127719 (2003-07-01), Chang
patent: 2003/0160311 (2003-08-01), Ismall et al.
patent: 2004/0082100 (2004-04-01), Tsukahara et al.
patent: 2004/0106230 (2004-06-01), Chan et al.
patent: 2004/0135242 (2004-07-01), Hsin
patent: 2004/0164390 (2004-08-01), Wang
patent: 2004/0188818 (2004-09-01), Wang
patent: 2004/0195667 (2004-10-01), Kamezos
patent: 2004/0262734 (2004-12-01), Yoo
patent: 2005/0064631 (2005-03-01), Tsai et al.
patent: 2006/0043559 (2006-03-01), Chow et al.
patent: 0736903 (1996-10-01), None

Affiliated with

Also associated with

Rating

Semiconductor component having stacked, encapsulated dice... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor component having stacked, encapsulated dice..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor component having stacked, encapsulated dice... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3814120